Collaboration with TU/e brings EFFECT Photonics new photonic


Door Bart Brouwers
  • 19 September 2016

In collaboration with the Technical University of Eindhoven (TU/e), EFFECT Photonics has succeeded in further improving the achievements of its optical ‘System-on-Chip’ photonic integration technology. Today the new transceiver product family will be launched in Dusseldorf.

Only 6 months after the successful launch of its 100Gbps DWDM transceiver product family, EFFECT Photonics is now demonstrating the ability to achieve 500Gbps using PAM-4 (4-level Pulse Amplitude Modulation) up to 75km, with its Optical ‘System-on-Chip’ photonic integration technology. This is the result of ongoing collaboration with the Technical University of Eindhoven, “with further developments in the pipeline”, as EFFECT promises.

“With Internet traffic expected to grow at an annual rate of 22-25% until 2020, the majority of this growth is coming from interconnecting Data Centres and in the Metro-Access segments”, VP Sales and Marketing, Robert Hughes says. “The need to reduce cost, power, and size continues to be a major driver of product innovation.”

EFFECT is addressing this need with its Optical ‘System-on-Chip’ photonic integration platform by combining all of the optical functions into a single chip, and packaging this with its own low-cost packaging technology. The optical functions include: multiple DBR lasers, low-voltage drive MZ modulators, AWG, and wavelength monitoring, all within the single chip.

Robert Hughes: “We knew very early on that combining many optical functions into a single ‘System-on-Chip’ offered a real alternative in the industry. This integration together with our novel packaging technology allows us to differentiate ourselves in the DCI and Metro-Access part of the network.”